Uniform Force Semiconductor Wafer Splitter Platform

Uniform Stress Distribution: The cleaver table is engineered to distribute force evenly across the semiconductor wafer. This uniform stress is essential for preventing wafer cracking or damage, which can occur if the force is not evenly applied. By ensuring that every part of the wafer experiences the same amount of stress, the design minimizes the risk of defects and maximizes the number of usable wafers produced.

Enhanced Yield Rate: The uniform force application directly contributes to a higher yield rate of semiconductor wafers. Since the risk of wafer damage is reduced, more wafers can be successfully cut and used in further manufacturing processes. This increase in yield rate is a significant advantage for manufacturers looking to optimize their production lines and reduce waste.

Cost-Effective Production: By reducing the number of wafers that are damaged or cracked during the cutting process, the cleaver table design helps to lower production costs. Manufacturers can achieve more from each silicon wafer, which leads to a more cost-effective production process and improved profitability.

Sophisticated Mechanism: The receiving table is equipped with a specific structure and mechanism that work in harmony to achieve the goal of uniform stress distribution. This includes a sturdy base, a rotating table for precise positioning, a circular receiving table for contact with the wafer, and a positioning mechanism to ensure accuracy. The driving mechanism is responsible for the smooth operation of the table, ensuring that the cutting process is efficient and reliable.

Soft Pad Contact: The circular receiving platform is designed to move up and down in an installation groove and comes into contact with the semiconductor wafer through a soft pad. The soft pad is sized to be no smaller than the semiconductor wafer itself, ensuring that the force is distributed uniformly across the entire surface of the wafer during the cutting process.

Optimized Force Distribution: The installation groove's diameter is carefully matched to the inner diameter of the peripheral steel ring. This design feature further optimizes the force distribution, leading to improved cutting accuracy and efficiency. The precision of this design ensures that the wafer is cut with minimal deviation, which is critical for the performance of the final product.

Material Utilization and Product Quality: The uniform force applied during the cutting process not only reduces the risk of wafer cracking or damage but also improves material utilization and product quality. By ensuring that each wafer is cut with the same level of precision, manufacturers can be confident in the quality of their products, leading to higher customer satisfaction and a stronger reputation in the market.