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Tungsten Steel Suction Nozzle/Insertion Nozzle Suction Nozzle
Features
The tungsten steel nozzle is made of imported tungsten steel, which has the characteristics of high hardness, high wear resistance and strong durability. Its hardness reaches Vickers 10K, second only to diamond, so it is not easily worn. Common specifications of this nozzle include inner diameter from 0.08mm to 0.5mm, length usually 14mm, 16mm, 17mm, etc., can be customized according to user needs. The excellent performance of tungsten steel nozzles makes them play an important role in the field of semiconductor packaging,especially in LED packaging,which can overcome the problem of insufficient life of materials such as bakelite nozzles and rubber nozzles,significantly Reduce the IR defective rate of LEDs and improve the yield rate.
Features
The wide application of tungsten steel nozzles is due to its high hardness and high wear resistance. It can basically maintain the hardness even at a temperature of 500°C, and can still maintain a high hardness at 1000°C. In addition, tungsten steel nozzles also have good strength and toughness, heat resistance, corrosion resistance, and are suitable for chip holding in various die bonding operations. Due to its excellent performance and durability, tungsten steel nozzles have become an indispensable and important accessory in the semiconductor packaging industry.
Tungsten steel nozzles, with their high hardness, high wear resistance, excellent strength and toughness, play an important role in semiconductor packaging, especially in the field of LED die-bonding, and are the key to improving product quality and efficiency. Accessories.
Specifications and models
Aperture: 3MIL, 3.5MIL, 4MIL, 5MIL, 6MIL, 8MIL, 10MIL....
Length: 14mm, 17mm
Remarks: Can be customized according to customer’s drawings or samples
At the same time, it can also be designed according to the customer's product, with different sizes to meet the customer's requirements.
application:
Used for chip/inductor/capacitor/LED/chip and other component packaging