Semiconductor Chip Splitting Machine Special Knife (Semiconductor Cutter Blade)

High-precision adjustment: The splitter is equipped with a micrometer precision angle adjustment device that allows for exceptional fine-tuning of the splitter inclination angle. This capability enables high-precision adjustments with an impressive range of 20 to 30 micrometers, ensuring maximum accuracy and efficiency in the splitting process.

Quick and convenient replacement: The splitter's design incorporates features for the rapid and convenient replacement of splitting tools of various sizes. This adaptability caters to the diverse needs of different chip sizes and types of cavity lengths, ultimately improving yield rates and operational efficiency in the splitting process.

Automated detection: Additionally, the splitter is equipped with a state-of-the-art contact sensor that accurately monitors the splitting position. The splitting position and depth can be precisely controlled via a PLC during operation, enhancing reliability. Furthermore, the splitter tracks its usage, automatically memorizing the number of cycles and preset limits as indicators for timely replacement. It also allows for the storage and retrieval of specific splitting operation programs, streamlining workflows.

Adapt to different chip sizes: The splitter's knife is engineered to accommodate chips of various dimensions. Whether dealing with large or small chips, efficient splitting is achievable through the swift and straightforward replacement of the appropriate splitting knives. This versatility greatly enhances both flexibility and efficiency throughout the splitting operation.

These innovative characteristics position the splitter's knife as an essential tool in the semiconductor industry, significantly contributing to improvements in product quality, reductions in production costs, and enhancements in overall production efficiency.